IHP : Innovations for High Performance Microelectronics
Future-proof specialised processors with a focus on hardware for edge applications and AI processors for the automotive sector were on the agenda of…. Future-proof specialised processors with a focus on hardware for edge applications and AI processors for the automotive sector were on the agenda of the joint event of the KI-Mobil, KI-Power and Scale4Edge projects. The project "Optoelectronic Sensors for Application-oriented Systems for Life Sciences and Intelligent Manufacturing – OASYS" celebrated its official launch at a festive kick-off event at the IKMZ of BTU Cottbus-Senftenberg.
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IHP : Research and Prototyping Service
Research & Prototyping Service | The Research & Prototyping Service group coordinates service and industry relevant development activities within Technology Department. | Dr. René Scholz | Contact and representatives of MPW Service worldwide: | Virtual Foundry EUROPRACTICE Service Center Fraunhofer IIS | Alfa Microonde srl | Kedem Technologies | Hong Kong Microsystem Integration Limited | Silicon RF Synergy | MPW & Prototyping Service | Technology Development Service | Wafer Level Measurement | Technology Transfer | Diagnostic & Test | Fast Design-Enablement | MPW & Prototyping Service | Technology Development Service | Wafer Level Measurement | Technology Transfer | Diagnostic & Test | Fast Design-Enablement | Quick links | SiGe:C-BiCMOS-Technologies | Job Offers | Silicon Photonics | Commercial Services | Clean Room | Customer Access
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IHP : SiGe:C-BiCMOS-Technologies
SiGe BiCMOS and Silicon Photonics Technologies | IHP offers standard 0.13 and 0.25 μm CMOS processes which provide NMOS, PMOS, isolated NMOS and passive components such as poly resistors and MIM capacitors. In addition to the standard CMOS processes different front-end-of-line options are offered. In 0.25 μm CMOS the standard backend offers 3 thin metal layers and two TopMetal layers (TopMetal1 - fourth 2 μm thick metal layer, TopMetal2 – fifth 3 μm thick metal layer). The backend for 0.13 μm process offers 5 thin and 2 thick metal layers (TM1: 2 μm TM2: 3 μm). Together with a high dielectric stack this enables increased performance of the passive RF components. | Technologies for MPW & Prototyping | The following Modules are available: | LBE | PIC | TSV | MEMRES | Quick links | SiGe:C-BiCMOS-Technologies | Job Offers | Silicon Photonics | Commercial Services | Clean Room | Customer Access
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IHP : MPW & Prototyping Service
MPW & Prototyping Service | IHP offers research partners and customers access to its powerful SiGe:C BiCMOS technologies with dedicated integrated RF and silicon photonics modules. | Dr. René Scholz | SiGe:C BiCMOS Technologies | Customer Access | Schedule & Price List | SiGe:C BiCMOS Technologies | Customer Access | Schedule & Price List | Quick links | SiGe:C-BiCMOS-Technologies | Job Offers | Silicon Photonics | Commercial Services | Clean Room | Customer Access
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Where is IHP located?
The company IHP is located in Frankfurt, Hesse, Germany. It's worth noting that the company may has more corporate locations
How many employees does IHP approximately have?
As of the latest available information IHP has around 101-250 employees worldwide.
When was IHP founded?
IHP was founded in 1983
In which industries does IHP mainly work?
The company IHP has it's main focus in the industries of Manufacturing, Consumer Electronics, Hardware, Others
What is the current company status of IHP?
Based on the founding year and the amount of employees the company IHP seems to be a Medium-Sized Company at the current state. Note that over time that status can change
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