Copper sinter pastes for high power and optoelectronics packaging
- Screen/stencil printing
- Mass production ready
- One formulation - multivariable capabilities, die-attach, substrate attach, Ag, Au & Cu metallization compatible
- Room temperature storage
- No nanoparticles, halogen free, RoHS compliant
- Room temperature die placement (no hot die placement required)
- No additional tacking agent required – paste with sufficient tack after predrying
- Designed and Made in Germany
