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Cuprum

Copper sinter paste

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Service

Cuprum

Copper sinter paste

Description

Copper sinter pastes for high power and optoelectronics packaging - Screen/stencil printing - Mass production ready - One formulation - multivariable capabilities, die-attach, substrate attach, Ag, Au & Cu metallization compatible - Room temperature storage - No nanoparticles, halogen free, RoHS compliant - Room temperature die placement (no hot die placement required) - No additional tacking agent required – paste with sufficient tack after predrying - Designed and Made in Germany

Product details

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Keywords:

Copper


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Sr Krishna Bhogaraju

CEO and Co-Founder