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Thin-film Encapsulation

Thin-film encapsulation is a process of coating a substrate, such as a chip or IC, with a thin protective layer of material. This layer is typically composed of a plastic, such as a polymer or epoxy, and is used to protect the underlying substrate from moisture, corrosion, and other environmental exposures. The encapsulation also helps to reduce the mechanical stresses on the substrate as well as providing a barrier to prevent contamination.

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