Large-area silver sintering

Use Case

Large-area silver sintering

Semiconductor, 3D packaing, Electronic Packaing

Large-area silver sintering process: innovative technology in packaging Large-area silver sintering technology is becoming an innovative focus in the packaging industry due to its lead-free environmentally friendly characteristics and excellent electrical and thermal conductivity . Initially, silver sintering technology was mainly used in surface mount packaging of small-size chips. However, with the rapid development of power electronics technology, this technology has gradually expanded to large-area packaging of power modules , especially playing an important role in silicon carbide (SiC) power module packaging. In addition, the silver sintering process can also directly mount the power module to the heat sink base, thereby significantly improving thermal management efficiency and providing a more reliable packaging solution for high-performance power electronic products.

Use Case

Lead solder paste

computer motherboards, phone motherboards, printed circuit boards (PCB), as well as a variety of high-precision electronic circuit boards. It is dedicated for the LED, SMT, electronic mount technology, and the plug-in components.

The Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste puts to use the alloy, comprising the 99% tin, the 0.3% silver and the 0.7% copper. With the melting point of 227 degrees Celsius, this product is fit for the reflow soldering process which has relatively high demand. Its preheat temperature ranges from 130 degrees Celsius to 170 degrees Celsius. Its reflow temperature varies from 280 degrees Celsius to 200 degrees Celsius. In addition, the flux contained in our Sn99Ag0.3Cu0.7 high temperature SMT lead free solder paste takes advantage of the highly reliable low-ion type halogen activator. In other words, our product features extremely high reliability, even if it is not cleaned after the reflow soldering process. The no-clean type lead free solder cream is applicable for the electronic PCB and SMT. There is no need to clean our product with other chemical agent. This product can be spread on the circuit board automatically, which offers much convenience and environmental protection. The water-soluble type tin paste adopts the plate-cleaning water or other simple agents to eliminate the slag.