Halo Industries

Using proprietary, laser-based hardware and processing technology, Halo Industries, Inc. delivers industry-best SiC wafer-per-millimeter yield, while eliminating the high levels of material stress and kerf loss caused by traditional wafering methods. By improving the availability of the highest quality SiC wafers and the semiconductor devices our wafers are used to produce, Halo is lowering a critical barrier to the deployment of reliable, efficient, and sustainable electrification products and platforms. In addition to silicon carbide, Halo Industries, Inc. is developing laser-based wafering and processing technologies for silicon, sapphire, diamond, and other critical materials.